Preface to Deep Water Sand Control
This 2-day course will present the main techniques used in completing deep water reservoirs with sanding tendencies and provide drilling and completion engineers with the sand control techniques that are commonly used in deep water. Participants will leave the course with a good understanding of the pros and cons of each technique and their general use in deep water completions. It will also provide them with enough understanding to short list options for their upcoming completions.
Cased hole sand control techniques
- Introduction to high rate water pack
- High rate water pack design
- High rate water pack case histories
- Introduction to frac pack
- Frac pack design
- Frac pack fluids
- Frac pack case histories
- Efficiency options
Open hole sand control techniques
- Screens and testing
- Open-hole gravel packing (OHGP) techniques
- α/β packing (water-packing) + basics and design considerations
- Alternate path + basics and design considerations
- Open hole gravel packing in oil-based mud environments + evaluation
- Selection considerations: SAS vs. OHGP (water-pack or alternate path)
- OH completion case histories
- Open hole vs. cased hole selection
Who Should Attend
Completion, drilling, and production engineers who have an interest in understanding the basics of sand control as performed in deep water completions.
Raymond Tibbles is currently a technical advisor for Schlumberger Sand Management Services, based in Kuala Lumpur, Malaysia. He has 31 years of industry experience, with 3 years in product development and 28 years in sand control and stimulation, all with Schlumberger. He has coauthored more than 15 technical papers and is the author of chapter 17 in the SPE Frac Packing for Sand Control Monograph. Tibbles jointly holds more than 15 US patents, dealing with both stimulation and sand control. He is an SPE Distinguished Member, SPE Distinguished Lecturer (2009/2010), and has been actively involved in many SPE events. Tibbles holds a BS degree in chemical engineering from the Michigan Technological University.